top of page
ZLSB002 Copper Core Solder Ball
  • ZLSB002 Copper Core Solder Ball

    Copper Core Solder Ball forms bumps between a substrate and a chip. And the core of the bumps keeps fixed height as designed and relieves an external impact as well. Copper Core Solder Ball is an excellent solution for the 3D stack package, and also has a certain application in the narrow-pitch packaging field.

     

    Features

    Stable packaging space, low electron-migration, excellent conductivity and thermal conductivity 
     

    Application

    POP package, succedaneum of high lead solder ball, solder joint size after packaging with strict requirements 

     

    Advantage

    More strict size and true roundness control, lower welding porosity, more considerate customization service, faster after-sale response 

      Request for Quotation
      bottom of page