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ZLSB004 Column with Copper Wrap
  • ZLSB004 Column with Copper Wrap

    The ceramic column grid array(CCGA) packaging 
    (diagonal size 􀀵 32mm) has become mature with ceramic columns . Column with copper wrap is another solution to CCGA package with longer service life , which can solve the problem of thermal expansion coefficient mismatch between chip and substrate. So it is widely used in military, aerospace and high-power processors area. 

     

    Features

    Good heat dissipation, larger package area and good adaptability of CTE, longer service life

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