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ZLSB008 Nano Ag-Cu Solder Paste

ZLSB008 Nano Ag-Cu Solder Paste

Nano Ag-Cu solder paste is a thermal interface material
that can effectivelytransfers heat generated by semiconductors or LED devices inside to outside. Solder paste that treated by our unique Nano-composite metal technology can effectively transfer the heat between
the thermally conductive fillers. It can provide good connection strength and conductivity, thereby provides excellent comprehensive performance. In addition, comparing with other products using silver powder, our product that applied Ag-Cu as the filler can greatly reduce the cost. And it may control various performance according to customer's requirements.

 

Features

Low temperature sintering and high temperature 
service; inhibition of silver migration; cost reduction; high 
thermal conductivity (up to lSOW/mK) 

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